What Is Ceramic Packaging

The case known as a package supports the electrical contacts which connect the device to a circuit board.

What is ceramic packaging.

In electronics manufacturing integrated circuit packaging is the final stage of semiconductor device fabrication in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. Remtec is dedicated to using its wide range of ceramic metallization and packaging technologies as well as its wide ranging equipment base modern manufacturing techniques and diverse industry experience to solve your electronic packaging problems. At kyocera international we provide custom and off the shelf packaging options in ceramic and organic material sets. At present alumina ceramic is the most mature ceramic packaging material which is widely used for its good thermal shock resistance and electrical insulation and mature manufacturing and processing technology.

Non intentionally added substances nias per and polyfluoroalkyl substances pfass phthalates. Ceramic packages are usually white because they are a high alumina material. Ametek offers both glass to metal seal and ceramic to metal seal technology to its customers. Packaging ceramics double boxing with packing peanuts packing peanuts should cover all sides of the pot and fill the entire box figure 4.

Depending on the application weight thermal solution and material requirements ametek can help you design a package using one of these technologies to best meet your requirements. Shipments with heavy work multiple items expensive pieces or pieces that fill most of the box should always be double boxed. Electronic substrate and package ceramics advanced industrial materials that owing to their insulating qualities are useful in the production of electronic components. Semiconductor packaging must now accommodate frequencies approaching 100 ghz withstand adverse environmental conditions and provide thermal relief for high power gan and sic devices.

It s crucial to avoid gaps in the attached material as these can lead to hot spots. Ceramic packaging substrate materials mainly include aluminum oxide beryllium oxide and aluminum nitride. Ceramic and plastic packages are engineered to have fairly high thermal conductivies 20w m k and they come at a fraction of the cost of a metal package. Substrate packages such as ceramic based packages will require an alloy that is similar in cte to ceramic like iconel or alloy 42.

We bond the die to the substrate with special die attach materials which we can use in face up wire bond assembly.